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| TAB Thermode Tools |
Recently, there has been a great increase in the demand for thin products such as IC cards, calculators, liquid crystal displays and
multi-pin IC chips. This increased demand had brought much attention to TAB (Tape Automated Bonding) which is used in
making these products. The severe conditions under which TAB bonding tools are used requires that they be made from a reliable
material possessing high heat resistance, wear resistance, corrosion resistance, and excellent heat conductivity.
Sumitomo Electric has three different bonding tool materials that meet this requirement:
- Sumicrystal (Synthetic Single Crystal Diamond)
- CVD Diamond (Chemical Vapor Deposited Diamond)
- T-cBN (Translucent-Cubic Boron Nitride)
Typical bonding material characteristics include:
- Thermal conductivity: 600W/m•K ~ 2000W/m•K
- Flatness: Less than 3um/RT
- Surface Roughness: Less than 0.2um
- Size: Greater than 1.0" depending on material
Lapping Plate
In addition to TAB bonding tools Sumitomo Electric also offer Lapping Plates. Lapping Plates are required because metal oxides
adhere to the bonding tool during usage. Our Lapping Plates are made with high purity Al2O3 ceramic. The Lapping Plate is
custom made to fit each customer's requirement.
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Please feel free to email HEATSINKS@sumitomo.com for additional information regarding specifications, quotations, availability, and brochures.
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