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| Heat Sink Materials |
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Semiconductor devices have been continuously improving, fostering great changes to the way we process data and communicate
with each other. One of the most fundamental technologies in the development of semiconductor devices is how to dissipate the
large amount of heat generated during operation. In order to solve this critical problem, Sumitomo Electric has successfully
developed a variety of heat sink materials with unique features such as, a high thermal conductivity, a low thermal expansion rate,
and a low dielectric constant.
1. Composite Materials for Substrate and Heatsinks (CMSH) is a combination of two or three different metals, with low and high
thermal expansion rates. CMSH is available in the following combinations:
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2. Aluminum Nitride Ceramics (AlN) are believed to be the most ideal material for ceramic substrates, replacing widely used BeO. It exhibits a low dielectric constant making it suitable for high frequency applications.
3. Diamond materials were developed by Sumitomo to meet the demand for dissipating large amounts of heat generated by advanced laser and microwave devices. These materials include:
- Sumicrystal (Synthetic Single Crystal Diamond type Ib)
- CVD-Diamond (Chemical Vapor Deposition diamond)
- DMCH (Diamond- Copper Compsite)
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Please feel free to email HEATSINKS@sumitomo.com for additional information regarding specifications, quotations, availability, and brochures.
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