Composite Materials for Substrates and Heatsinks
 Copper Tungsten |
 Copper Molybdenum |
 Aluminum Nitride |
 Copper Diamond |
 Aluminum Silicon Carbide |
 Sumicrystal |
 CVD Diamond |
Semiconductor devices have been continuously improving, and fostering incredible changes in the way we process data, communicate with each other, and interact with technology. One of the most fundamental necessities in the development of semiconductor devices is the need to dissipate the large amounts of heat that is generated during operation of such devices. In order to solve this critical problem, Sumitomo Electric has successfully developed a variety of heat sink materials with high thermal conductivity and a unique variety of low thermal expansion rates engineered to best compliment common semiconductor materials.
