Non-halogen Highly Flexible FPC
With recent advancements in high functional performance in electronic packaging, such as HDD (Hard Disk Drive) products, it’s critical that flexibility endurance not be compromised by high temperature conditions.
Sumitomo Electric has developed adhesive systems for base and coverlay composites which not only meet industry flexibility performance but also environmental standards for halogen free materials.
Property Values
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Item
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Test Method
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Property Value
|
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Flexibility underHigh Temperature
|
90℃ R2.5mm
Stroke15mm 1500rpm,
L/S=0.2/0.8
|
112 million cycles
(*1)
|
|
Circuit peel-off strength
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JIS C5016-8.1
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6.9N/cm or above
|
|
Coverlay peel-off strength
|
JIS C5016-8.1
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3.4N/cm or above
|
|
Surface insulationresistance
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JIS C5016-7.6
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5×108Ω or above
|
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Surface anti-voltage
|
JIS C5016-7.5
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No flash-over at AC500V
|
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Solder heat resistance
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JIS C5016-10.3
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No bulge or peel-off
|
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Anti-environment
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JIS C5016-9.1 Condition(2)
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After test,Conductor resistance change rate…20% or belowNo peel-off of land,no damage of base film,no peel-off of coverlayby visual inspection
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|
Anti-humidity
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JIS C5016-9.5
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After test,Insulation resistancebetween lines…1×108Ω or above
(Apply DC50V)
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|
Chemical resistance
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JIS C5016-10.5
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No bulge or peel-off
|
|
(*1) This is measured value and not guaranteed value.
