FPC for High Density Component Mounting

Sumitomo Electric has developed high volume CSP mounting technology for information and communication market segments where extremely high functional performance and capability are required.

A focus in advanced high density technologies provides the strength in our highly functional product capabilities.

Material Composition

CSP Mounted Area

Structure

• Electrical connection between both sides are formed by blind via-holes.
• All area of one side can be used for parts mounting.

* FPC with a terminal pitch of 0.35mm or smaller is currently being developed.